TAIPEI, March 28, 2025 /PRNewswire/ — Gospower, a leading provider of AI server power solutions, participated in the 2025 SuperFluid Advanced Cooling Community Conference hosted by the Advanced Microsystems and Packaging Alliance (AMPA) and co-organized by Intel and the Heterogeneous Integration System-in-Package Development Alliance (Hi-CHIP). The event brought together over 500 industry experts and 10+ Intel ecosystem partners. Gospower delivered a keynote speech highlighting its pioneering immersion cooling technologies, positioning itself at the forefront of next-generation AI server power thermal management innovation.
With surging computational demands from AI, 5G, and high-performance computing (HPC) driving chip power consumption to kilowatt levels, thermal management has become a critical industry challenge. Intel’s SuperFluid cooling technology, first introduced in 2023, has already provided immersion cooling solutions for NVIDIA’s GB300 platform. As a key Intel ecosystem partner, Gospower established a Joint Advanced Thermal Technology Lab with Intel in March 2024 to accelerate R&D in immersion cooling systems.
Gospower Immersion Cooling Al Power Solutions
Immersion Liquid-Cooled Power Solutions: Redefining Reliability
At the forum, Mr. Wenfei Zhou, Director of Resource Development at Gospower, unveiled the lab’s latest achievement: the Immersion Cooling AI Power Solution integrated with proprietary nano-coating processes. This marks the industry’s first Immersion cooling power supply system designed for AI server clusters.
Gospower’s wafer-level nano-coating technology ensures IPX8-rated liquid resistance, enabling compatibility with diverse dielectric coolants while maintaining operation in extreme environments (e.g., salt fog, dust, humidity). The solution achieves 98% peak efficiency with a 30% improvement in critical component heat dissipation, meeting the rigorous demands of high-density AI computing.
Rigorous Validation: Safety Under Stress
A live demonstration showcased Gospower’s power supply operating normally even when fully submerged in deionized water, simulating coolant leakage scenarios. This validates its exceptional insulation integrity under fault conditions.
Future Roadmap: Aligning with Industry Needs
Gospower’s comprehensive AI server power product portfolio aligns closely with evolving market requirements. The company remains committed to advancing cutting-edge thermal management technologies to empower AI power development.
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