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- Accelerates commercialization of robotics AI chip through end-to-end "Spec Hand-off" development
- Integrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 and UCIe-S
- Expands applications beyond data center, HPC and edge AI into Physical AI, diversifying business portfolio
SEOUL, South Korea, Oct. 1, 2026 /PRNewswire/ — SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced today that it has signed a turnkey development contract with Mobilint, a South Korean AI semiconductor company, to develop an AI chip for robotics applications.
The project is part of the "K-On-Device AI Semiconductor Technology Development" program led by Korea’s Ministry of Trade, Industry and Resources (MOTIR). The government-funded program supports collaboration between domestic AI semiconductor companies and end-user companies to develop and validate chips tailored to industry-specific products, with the core objective of carrying them through to commercialization.
Through this collaboration, the two companies aim to deliver a robotics chip capable of performing high-performance AI computation on its own, even in outdoor environments where connectivity to external servers is limited. The custom chip will be deployed in applications such as agricultural robots, processing vision and sensor data in real time across diverse operating conditions.
Notably, the project will be carried out under SEMIFIVE’s "Spec Hand-off" model, the earliest-stage engagement within its turnkey business. Unlike conventional approaches in which customers complete a substantial portion of the design before handing off downstream processes, Spec Hand-off allows customers to simply define their key performance targets and specifications, while SEMIFIVE delivers integrated services across the entire process, from detailed design to packaging, testing and mass production.
The chip will integrate a wide range of next-generation technologies, including LPDDR6, the latest low-power DRAM standard; PCIe Gen6, a high-speed interface; and UCIe-S (Universal Chiplet Interconnect Express – Standard Package), which connects multiple function-specific chiplets at high speed within a single package so they operate as a single monolithic die. These technologies will enable the chip to achieve both high power efficiency and operational stability without data bottlenecks, even in outdoor settings such as areas with limited network coverage.
The two companies expect the collaboration to contribute to building a homegrown AI semiconductor ecosystem in Korea, while securing an early lead in next-generation robotics platforms and creating new markets.
"This contract marks a pivotal moment for SEMIFIVE as we extend our proven, end-to-end ASIC capabilities from data center and edge AI into the realm of robotics AI," said Brandon Cho, CEO and co-founder of SEMIFIVE. "As a leader in custom semiconductors, we will continue to expand our technological footprint and influence across advanced industries."
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